ADRF6806ACPZ-R7 datasheet(36/36 Pages) AD

36 / 36 page

ADRF6806

Data Sheet

Rev. B | Page 36 of 36

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-2

4.45

4.30 SQ

4.15

TOP

VIEW

6.00

BSC SQ

5.75

BSC SQ

COPLANARITY

0.08

4.50

REF

0.50

0.40

0.30

0.50

BSC

PIN 1

INDICATOR

0.60 MAX

0.25 MIN

EXPOSED

PAD

(BOT TOM VIEW)

PIN 1

INDICATOR

0.30

0.23

0.18

0.20 REF

12° MAX

0.80 MAX

0.65 TYP

1.00

0.85

0.80

0.05 MAX

0.02 NOM

SEATING

PLANE

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 53. 40-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

6 mm × 6 mm Body, Very Thin Quad

(CP-40-4)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

Ordering

Quantity

ADRF6806ACPZ-R7

−40°C to +85°C

40-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-40-4

750

ADRF6806-EVALZ

Evaluation Board

1 Z = RoHS Compliant Part.

registered trademarks are the property of their respective owners.

D09335-0-3/12(B)

ADRF6806ACPZ-R7 数据表(PDF) 36 Page - Analog Devices

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