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PIP3102-R 数据表(PDF) 10 Page - NXP Semiconductors

部件名 PIP3102-R
功能描述  LOGIC LEVEL TOPFET
PDF  13 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  PHILIPS [NXP Semiconductors]
网页  http://www.nxp.com
标志 PHILIPS - NXP Semiconductors

PIP3102-R 数据表(HTML) 10 Page - NXP Semiconductors

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Philips Semiconductors
Product Specification
Logic level TOPFET
PIP3102-R
Fig.26. Clamping energy test circuit, R
IS = 100 Ω.
Fig.27. Typical non-repetitive clamping energy.
E
DSM = f(L); conditions: VIS = 0 V
Fig.28. Typical clamping characteristic, 25˚C.
I
D = f(VDS); conditions: VIS = 0 V; tp ≤ 300 µs
Fig.29. Test circuit for resistive load switching times.
V
IS = 5 V
Fig.30. Typical switching waveforms, resistive load.
R
L = 10 Ω; adjust VDD to obtain ID = 1.5 A; Tj = 25˚C
Fig.31. Overvoltage clamping characteristic.
V
DS = f(Tj); conditions: VIS = 0 V; tp ≤ 300 µs
L
D.U.T.
VDD
RI = RIS
R 01
VDS
-ID/100
+
-
shunt
VIS
0
ID
0
VDS
0
VDD
V(CL)DSR
D
S
I
TOPFET
P
F
P
RF
VPS
+
D
S
I
TOPFET
P
F
P
VII
RI
RIS
VIS
E
DSM = 0.5 ⋅ LID
2
⋅ V
(CL)DSR/(V(CL)DSR − VDD)
0
0.2
0.4
0.6
0.8
1.0
1.2
0.1
1
10
100
EDSM / J
25
OC
150
OC
L / mH
0
2
4
6
8
10
12
14
16
0
5
10
15
20
25
30
35
40
45
50
VIS & VDS / V
Time / µs
VIS
VDS
0
1
2
3
4
50
60
70
ID / A
VDS / V
VDSS / V
60
65
-50
0
50
100
150
Tj /
OC
ID =
4A
10mA
October 2002
10
Rev 1.000



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