Philips Semiconductors

Product Specification

Logic level TOPFET

PIP3102-R

MECHANICAL DATA

Fig.36. SOT426 surface mounting package

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOT426

0

2.5

5 mm

scale

(one lead cropped)

SOT426

e

e

e

e

E

b

A1

A

A1

Lp

bc

D

max.

e

A

UNIT

DIMENSIONS (mm are the original dimensions)

E

11

mm

4.50

4.10

1.40

1.27

0.85

0.60

0.64

0.46

2.90

2.10

HD

15.80

14.80

Q

2.60

2.20

10.30

9.70

D1

1.60

1.20

1.70

98-12-14

99-06-25

1

3

24

5

mounting

base

D1

HD

D

Q

Lp

c

1 Epoxy meets UL94 V0 at 1/8". Net mass: 1.5 g.

For soldering guidelines and SMD footprint design, please refer to Data Handbook SC18.

October 2002

12

Rev 1.000