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ADP1972ARUZ-R7 数据表(PDF) 5 Page - Analog Devices |
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ADP1972ARUZ-R7 数据表(HTML) 5 Page - Analog Devices |
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5 / 18 page ![]() Data Sheet ADP1972 Rev. B | Page 5 of 18 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Rating VIN, EN, FAULT to GND −0.3 V to +61 V SYNC, COMP, MODE to GND −0.3 V to +5.5 V DH, DL, SS, DMAX, SCFG, CL to GND −0.3 V to VREG + 0.3 V GNDSENSE to GND −0.3 V to +0.3 V Operating Ambient Temperature Range −40°C to +85°C Junction Temperature 125°C Storage Temperature Range −65°C to +150°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Absolute maximum ratings apply individually only, not in combination. THERMAL OPERATING RANGES The ADP1972 can be damaged when the junction temperature limits are exceeded. The maximum operating junction temperature (TJ MAX) takes precedence over the maximum operating ambient temperature (TA MAX). Monitoring ambient temperature does not guarantee that the junction temperature (TJ) is within the specified temperature limits. In applications with high power dissipation and poor printed circuit board (PCB) thermal resistance, the maximum ambient temperature may need to be derated. In applications with moderate power dissipation and low PCB thermal resistance, the maximum ambient temperature can exceed the maximum limit when the junction temperature is within specification limits. The junction temperature (TJ) of the device is dependent on the ambient temperature (TA), the power dissipation of the device (PD), and the junction to ambient thermal resistance of the package (θJA). Use the following equation to calculate the maximum junction temperature (TJ) from the ambient temperature (TA) and power dissipation (PD): TJ = TA + (PD × θJA) (1) For additional information on thermal resistance, refer to Application Note AN-000, Thermal Characteristics of IC Assembly. ESD CAUTION |
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