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ADP5041ACPZ-1-R7 数据表(PDF) 34 Page - Analog Devices |
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ADP5041ACPZ-1-R7 数据表(HTML) 34 Page - Analog Devices |
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34 / 40 page ![]() ADP5041 Data Sheet Rev. B | Page 34 of 40 Watchdog Software Considerations In implementing the watchdog strobe code of the micro- processor, quickly switching WDI low to high and then high to low (minimizing WDI high time) is desirable for current consumption reasons. However, a more effective way of using the watchdog function can be considered. A low-to-high-to-low WDI pulse within a given subroutine prevents the watchdog from timing out. However, if the sub- routine is held in an infinite loop, the watchdog cannot detect this because the subroutine continues to toggle WDI. A more effective coding scheme for detecting this error involves using a slightly longer watchdog timeout. In the program that calls the subroutine, WDI is set high. The subroutine sets WDI low when it is called. If the program executes without error, WDI is toggled high and low with every loop of the program. If the subroutine enters an infinite loop, WDI is kept low, the watchdog times out, and the microprocessor is reset (see Figure 112). START SET WDI HIGH PROGRAM CODE SUBROUTINE SET WDI LOW RETURN INFINITE LOOP: WATCHDOG TIMES OUT RESET Figure 112. Watchdog Flow Diagram POWER DISSIPATION/THERMAL CONSIDERATIONS The ADP5041 is a highly efficient micropower management unit (micro PMU), and in most cases the power dissipated in the device is not a concern. However, if the device operates at high ambient temperatures and with maximum loading conditions, the junction temperature can reach the maximum allowable operating limit (125°C). When the junction temperature exceeds 150°C, the ADP5041 turns off all the regulators, allowing the device to cool down. Once the die temperature falls below 135°C, the ADP5041 resumes normal operation. This section provides guidelines to calculate the power dissi- pated in the device and to make sure the ADP5041 operates below the maximum allowable junction temperature. The efficiency for each regulator on the ADP5041 is given by 100% OUT IN P P (1) where: η is efficiency. PIN is the input power. POUT is the output power. Power loss is given by PLOSS = PIN − POUT (2a) or PLOSS = POUT (1-η)/η (2b) The power dissipation of the supervisory function is small and negligible. Power dissipation can be calculated in several ways. The most intuitive and practical is to measure the power dissipated at the input and all the outputs. The measurements should be performed at the worst-case conditions (voltages, currents, and temperature). The difference between input and output power is dissipated in the device and the inductor. Use Equation 4 to derive the power lost in the inductor, and from this use Equation 3 to calculate the power dissipation in the ADP5041 buck regulator. A second method to estimate the power dissipation uses the efficiency curves provided for the buck regulator, wheras the power lost on a LDO is calculated using Equation 12. When the buck efficiency is known, use Equation 2b to derive the total power lost in the buck regulator and inductor. Use Equation 4 to derive the power lost in the inductor, and then calculate the power dissipation in the buck converter using Equation 3. Add the power dissipated in the buck and in the LDOs to find the total dissipated power. Note that the buck efficiency curves are typical values and may not be provided for all possible combinations of VIN, VOUT, and IOUT. To account for these variations, it is necessary to include a safety margin when calculating the power dissipated in the buck. A third way to estimate the power dissipation is analytical and involves modeling the losses in the buck circuit provided by Equation 8 to Equation 11 and the losses in the LDOs provided by Equation 12. Buck Regulator Power Dissipation The power loss of the buck regulator is approximated by PLOSS = PDBUCK + PL (3) where: PDBUCK is the power dissipation on the ADP5041 buck regulator. PL is the inductor power losses. The inductor losses are external to the device and they do not have any effect on the die temperature. |
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