USB4715

DS00002514B-page 32

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2022 Microchip Technology Inc. and its subsidiaries

9.3

Package Thermal Specifications

9.4

Power Consumption

This section details the power consumption of the device as measured during various modes of operation. Power dis-

sipation is determined by temperature, supply voltage, and external source/sink requirements.

Note:

The rise time for the 3.3V supply can be extended to 100ms max if RESET_N is actively driven low, typi-

cally by another IC, until 1 μs after all supplies are within operating range.

TABLE 9-1:

PACKAGE THERMAL PARAMETERS

Symbol

°C/W

Velocity (Meters/s)

28

0

25

1

15

0

0.2

0

2.4

0

Note:

Thermal parameters are measured or estimated for devices in a multi-layer 2S2P PCB per JESDN51.

TABLE 9-2:

DEVICE POWER CONSUMPTION

Description

Typical Current

(mA)

Maximum

Current (mA)

Reset Current (mA)

0.40

3.60

Suspend Current (mA)

0.40

3.60

Idle

56

67

Active Operation (4 Hi-Speed Devices)

148

167

Active Operation (1 Hi-Speed, 1 Full-Speed Device)

73

74

Active Operation (2 Hi-Speed, 2 Full-Speed Devices)

97

98

Active Operation (2 Hi-Speed, 1 Full-Speed Device)

96

97

Active Operation (1 Full-Speed Device)

57

58

Active Operation (4 Full-Speed Devices)

64

65

Active Operation (1 Hi-Speed Device)

73

74

Active Operation (2 Hi-Speed Devices)

102

103

Active Operation (3 Hi-Speed Devices)

122

123

Active Operation (FlexConnect enabled on 1 port, Hi-Speed

data transfer on 4 ports)

149

150