4

Electrical and thermal specifications

4.1

Absolute maximum ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings

only and operation of the device at these or any other condition above those indicated in Table 2 is not implied.

Exposure to absolute maximum rated conditions for extended periods may affect device reliability.

Parameter

Pin(s)

Min.

Max.

Unit

Pin voltage range

AC1, AC2, COMM1, COMM2, CLAMP1 and CLAMP2

respect to ground (VSSA, VSSD and VSSP pins)

-0.9

27

V

BOOT1 to AC1

-0.3

5.5

BOOT2 to AC2

BOOT1 and BOOT2 respect to ground (VSSA, VSSD

and VSSP pins)

-0.3

27

BOOT respect to VRECT

-0.3

5.5

VRECT, VOUT and IEXT respect to ground (VSSA,

VSSD and VSSP pins)

-0.7

27

V1V8, NTC, VS and DFT respect to ground (VSSA,

VSSD and VSSP pins)

-0.3

2

V5V0, VGATE, GPIO0 through GPIO5, INTB, RSTB,

SDA, SCL and BOOT_SEL respect to ground (VSSA,

VSSD and VSSP pins)

-0.7

5.5

Relative voltage between any ground pin (VSSA,

VSSD, VSSP)

-0.3

0.3

HBM ESD susceptibility

JEDEC JS001-2012

All pins

2000

V

CDM ESD susceptibility

JEDEC JS002-2012

500

Latch-Up EIA/JESD78E

-200

200

mA

4.2

Thermal characteristics

Symbol

Parameter

Conditions

Min.

Typ.

Max.

Unit

Operating ambient temperature

-40

85

°C

Operating junction temperature

0

125

Junction to ambient thermal resistance

2s2p

40

°C/W

Thermal shutdown threshold

125

°C

Thermal shutdown hysteresis

10

2. Device mounted on a standard JESD51-5 test board

STWLC68

Electrical and thermal specifications

DS13131 - Rev 3

page 6/32