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CBTL05024BSHP 数据表(PDF) 21 Page - NXP Semiconductors |
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CBTL05024BSHP 数据表(HTML) 21 Page - NXP Semiconductors |
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21 / 21 page ![]() NXP Semiconductors CBTL05024 High performance MUX/deMUX switch for Thunderbolt applications © NXP Semiconductors N.V. 2014. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 27 March 2014 Document identifier: CBTL05024 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 16. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 2.1 TB MUX 3 : 1 switch . . . . . . . . . . . . . . . . . . . . . 1 2.2 DP MUX 2 : 1 switch. . . . . . . . . . . . . . . . . . . . . 2 2.3 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 3.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3 4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 5 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6 6 Functional description . . . . . . . . . . . . . . . . . . . 7 6.1 Buffer function tables . . . . . . . . . . . . . . . . . . . . 7 6.2 AUX MUX function table . . . . . . . . . . . . . . . . . . 7 6.3 Operation modes of both DPML MUX and TB MUX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8 8 Recommended operating conditions. . . . . . . . 8 9 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 9 9.1 Device general characteristics . . . . . . . . . . . . . 9 9.2 3 : 1 TB MUX channel characteristics. . . . . . . . 9 9.3 DP MUX channel characteristics . . . . . . . . . . 11 9.4 Control signals characteristics . . . . . . . . . . . . 12 9.5 Integrated LSRX buffer characteristics . . . . . . 13 9.6 Bias resistor characteristics . . . . . . . . . . . . . . 13 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14 11 Soldering of SMD packages . . . . . . . . . . . . . . 15 11.1 Introduction to soldering . . . . . . . . . . . . . . . . . 15 11.2 Wave and reflow soldering . . . . . . . . . . . . . . . 15 11.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 15 11.4 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 16 12 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 17 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18 14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 19 14.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19 14.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 14.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 14.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 20 15 Contact information. . . . . . . . . . . . . . . . . . . . . 20 16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 |
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