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CBTL05024BSHP 数据表(PDF) 8 Page - NXP Semiconductors |
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CBTL05024BSHP 数据表(HTML) 8 Page - NXP Semiconductors |
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8 / 21 page ![]() CBTL05024 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4 — 27 March 2014 8 of 21 NXP Semiconductors CBTL05024 High performance MUX/deMUX switch for Thunderbolt applications 7. Limiting values [1] All voltage values, except differential voltages, are with respect to network ground terminal. [2] Human Body Model: ANSI/ESDA/JEDEC JDS-001-2012 (Revision of ANSI/ESDA/JEDEC JS-001-2011), ESDA/JEDEC Joint standard for ESD sensitivity testing, Human Body Model – Component level; Electrostatic Discharge Association, Rome, NY, USA; JEDEC Solid State Technology Association, Arlington, VA, USA. [3] Charged Device Model: JESD22-C101E December 2009 (Revision of JESD22-C101D, October 2008), standard for ESD sensitivity testing, Charged Device Model – Component level; JEDEC Solid State Technology Association, Arlington, VA, USA. 8. Recommended operating conditions [1] During power supply negotiation only a limited supply voltage is available. The control logic and multiplexers must be in full function with degraded performance. The channel between LSTX/LSRX and DPMLO+/ must work. The initial R on of DP MUX in Table 14 should be < 50 . Table 8. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDD supply voltage [1] 0.3 +4.6 V VI input voltage [1] 0.3 +5.5 V Tstg storage temperature 65 +150 C VESD electrostatic discharge voltage HBM [2] - 2000 V CDM [3] - 1000 V Table 9. Operating conditions Symbol Parameter Conditions Min Typ Max Unit VDD supply voltage 3.3 V supply option 3.0 3.3 3.6 V initial supply voltage before power supply negotiation done [1] 2.3 - - V VI input voltage CMOS inputs 0.3 - +5.5 V MUX I/O pins 0.3 - VDD +0.3 V Tamb ambient temperature operating in free air 20 - +85 C |
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