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BAV20WS-TP 数据表(PDF) 31 Page - Infineon Technologies AG |
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BAV20WS-TP 数据表(HTML) 31 Page - Infineon Technologies AG |
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31 / 47 page ![]() User Manual 31 of 47 Revision 1.4 2020-07-16 EVAL-M3-IM564 User Manual iMOTION™ Modular Application Design Kit Hardware description of EVAL-M3-IM564 If the setting temperature is 100 °C, @ =5.576kohm,andtheshutdownvalueshouldbe 2.33 V. If the setting temperature is 80 °C, @ =10.593kohm,andtheshutdownvalue should be 2.36 V. Figure 28 External temperature sense input configuration in MCEWizard 4.4 System thermal resistance testing 4.4.1 Heatsink thermal resistance In order to test the thermal impedance of heatsink to ambient RthCA, the DC source is used to conduct the IPM internal diodes, as shown in Figure 29. With the DC source voltage increasing, current through IPM IIPM and voltage on IPM VIPM are monitored by current and voltage meter, the IPM case-temperature test point is between IPM and heasink, as shown in Figure 29 below, the same as Tc point of inverter IGBT of the IPM daasheet [1]. CIPOSTM IPM IM564-X6D + - A V VIPM IIPM ` PCB Heatsink Case temperature (Tc) test point Figure 29 Heatsink thermal testing set-up Thermal resistance between junction to ambient RthJA is divided into 2 parts as in the following formula: thermal resistance between junction to case RthJC and thermal resistace between case to ambient RthCA. |
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