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BAV20WS-TP 数据表(PDF) 31 Page - Infineon Technologies AG

部件名 BAV20WS-TP
功能描述  iMOTION™ Modular Application Design Kit
PDF  47 Pages
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制造商  INFINEON [Infineon Technologies AG]
网页  http://www.infineon.com
标志 INFINEON - Infineon Technologies AG

BAV20WS-TP 数据表(HTML) 31 Page - Infineon Technologies AG

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User Manual
31 of 47
Revision 1.4
2020-07-16
EVAL-M3-IM564 User Manual
iMOTION™ Modular Application Design Kit
Hardware description of EVAL-M3-IM564
If the setting temperature is 100 °C,
@
=5.576kohm,andtheshutdownvalueshouldbe
2.33 V. If the setting temperature is 80 °C,
@
=10.593kohm,andtheshutdownvalue
should be 2.36 V.
Figure 28 External temperature sense input configuration in MCEWizard
4.4
System thermal resistance testing
4.4.1
Heatsink thermal resistance
In order to test the thermal impedance of heatsink to ambient RthCA, the DC source is used to conduct the IPM
internal diodes, as shown in Figure 29. With the DC source voltage increasing, current through IPM IIPM and
voltage on IPM VIPM are monitored by current and voltage meter, the IPM case-temperature test point is
between IPM and heasink, as shown in Figure 29 below, the same as Tc point of inverter IGBT of the IPM
daasheet [1].
CIPOSTM IPM IM564-X6D
+
-
A
V
VIPM
IIPM
`
PCB
Heatsink
Case temperature (Tc) test point
Figure 29 Heatsink thermal testing set-up
Thermal resistance between junction to ambient RthJA is divided into 2 parts as in the following formula: thermal
resistance between junction to case RthJC and thermal resistace between case to ambient RthCA.



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