AT24C01C datasheet(33/45 Pages) MICROCHIP

33 / 45 page

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

(c)

VIEW A-A

SHEET 1

protrusions shall not exceed 0.25mm per side.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Foot Angle

Number of Leads

Pitch

Outside lead pitch

Overall Height

Molded Package Thickness

Standoff

Overall Width

Molded Package Width

Overall Length

Foot Length

Footprint

Lead Thickness

Lead Width

Notes:

Dimension Limits

Units

0°

0.08

0.30

8°

0.20

0.50

MILLIMETERS

0.95 BSC

1.90 BSC

0.30

0.70

0.60 REF

2.90 BSC

2.80 BSC

1.60 BSC

0.90

MIN

NOM

1.10

1.00

0.10

0.60

MAX

REF: Reference Dimension, usually without tolerance, for information purposes only.

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or

Dimensioning and tolerancing per ASME Y14.5M

Microchip Technology Drawing C04-21344 Rev B Sheet 2 of 2

5-Lead Plastic Thin Small Outline Transistor (NMB) [TSOT]

Atmel Legacy Global Package Code TSZ

AT24C01C/AT24C02C

Packaging Information

Datasheet

DS20006111A-page 33

AT24C01C 数据表(PDF) 33 Page - Microchip Technology

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