9.5

Pb-free solder reflow process

Table 17. Recommended solder profile and Figure 25. Solder profile show the recommended and maximum

values for the solder profile.

Customers have to tune the reflow profile depending on the PCB, solder paste and material used. We expect

customers to follow the recommended reflow profile, which is specifically tuned for package.

For any reason, if a customer must perform a reflow profile which is different from the recommended one

(especially peak >240°C), this new profile must be qualified by the customer at their own risk. In any case, the

profile must be within the “maximum” profile limit described in the following table.

Note:

Temperature mentioned in the following table are measured at the top of the package.

Table 17. Recommended solder profile

Parameters

Recommended

Maximum

Unit

Minimum temperature (TS min)

130

150

°C

Maximum temperature (TS max)

200

200

Time ts (TS min to TS max)

90-110

60-120

s

Temperature (TL)

217

217

°C

Time (tL)

55-65

55-65

s

Ramp up

2

3

°C/s

Temperature (Tp-10)

-

250

°C

Time (tp-10)

10

s

Ramp up

3

°C/s

Peak temperature (Tp)

240

260 max

°C

Time to peak

30

300

s

Ramp down (peak to Tl)

-4

-6

°C/s

Figure 25. Solder profile

Note:

The component should be limited to a maximum of three passes through this solder profile.

Note:

As the VL53L4CD package is not sealed, only a dry reflow process should be used (such as convection reflow).

Vapor phase reflow is not suitable for this type of optical component.

Note:

The VL53L4CD is an optical component and as such, it should be treated carefully. This would typically include

using a ‘no wash’ assembly process.

VL53L4CD

Pb-free solder reflow process

DS13812 - Rev 5

page 29/37