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VL53L4CD 数据表(PDF) 30 Page - STMicroelectronics |
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VL53L4CD 数据表(HTML) 30 Page - STMicroelectronics |
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30 / 37 page ![]() 9.6 Handling and storage precautions 9.6.1 Shock precaution Sensor modules house numerous internal components that are susceptible to shock damage. If a unit is subject to excessive shock, is dropped on the floor, or a tray/reel of units is dropped on the floor, it must be rejected, even if no apparent damage is visible. 9.6.2 Part handling Handling must be done with non-marring ESD safe carbon, plastic, or teflon tweezers. Ranging modules are susceptible to damage or contamination. The customer is advised to use a clean assembly process after removing the tape from the parts, and until a protective cover glass is mounted. 9.6.3 Compression force A maximum compressive load of 25 N should be applied on the module. 9.6.4 Moisture sensitivity level Moisture sensitivity is level 3 (MSL) as described in IPC/JEDEC JSTD-020-C. 9.7 Storage temperature conditions Table 18. Recommended storage conditions Parameter Min. Typ. Max. Unit Temperature (storage) -40 23 85 °C VL53L4CD Handling and storage precautions DS13812 - Rev 5 page 30/37 |
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