VL53L4CD datasheet(36/37 Pages) STMICROELECTRONICS

36 / 37 page

9.1

Product marking .............................................................. 27

9.2

Inner box labeling ............................................................. 27

9.3

Packing...................................................................... 27

9.4

Tape outline drawing........................................................... 28

9.5

Pb-free solder reflow process ................................................... 29

9.6

Handling and storage precautions ............................................... 30

9.6.1

Shock precaution ....................................................... 30

9.6.2

Part handling........................................................... 30

9.6.3

Compression force ...................................................... 30

9.6.4

Moisture sensitivity level .................................................. 30

9.7

Storage temperature conditions ................................................. 30

Package information..............................................................31

Ordering information .............................................................32

Acronyms and abbreviations .....................................................33

Revision history .......................................................................34

VL53L4CD

Contents

DS13812 - Rev 5

page 36/37

VL53L4CD 数据表(PDF) 36 Page - STMicroelectronics