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ADRF5301BCCZN-R7 数据表(PDF) 9 Page - Analog Devices

部件名 ADRF5301BCCZN-R7
功能描述  Silicon, SPDT Switch, 37 GHz to 49 GHz
PDF  10 Pages
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制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADRF5301BCCZN-R7 数据表(HTML) 9 Page - Analog Devices

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Data Sheet
ADRF5301
APPLICATIONS INFORMATION
analog.com
Rev. 0 | 9 of 10
The ADRF5301 has one power supply pin (VDD) and one con-
trol pin (CTRL). Figure 14 shows the external components and
connections for the supply pin. The VDD pin is decoupled with
a 100pF multilayer ceramic capacitor. The device pin-out allows
the placement of the decoupling capacitors close to the device.
No other external components are needed for bias and operation,
except DC blocking capacitors on the RF pins when the RF lines
are biased at a voltage different than 0 V. See the Pin Configuration
and Function Descriptions section for details.
Figure 14. Recommended Schematic
RECOMMENDATIONS FOR PRINTED CIRCUIT
BOARD DESIGN
The RF ports are matched to 50 Ω internally and the pinout is
designed to mate a coplanar waveguide (CPWG) with 50 Ω charac-
teristic impedance on the PCB. Figure 15 shows the referenced
CPWG RF trace design for an RF substrate with 8 mil thick Rogers
RO4003 dielectric material. RF trace with 14mil width and 7 mil
clearance is recommended for 2.2 mil finished copper thickness.
Figure 15. Example PCB Stack-Up
Figure 16 shows the routing of the RF traces, supply, and control
signals from the device. The ground planes are connected with as
many filled, through vias as allowed for optimal RF, and thermal
performance. The primary thermal path for the device is the bottom
side.
Figure 16. PCB Routings
Figure 17 shows the recommended layout from the device RF pins
to the 50 Ω CPWG on the referenced stack-up. PCB pads are
drawn 1:1 to device pads. The ground pads are drawn soldermask
defined and the signal pads are drawn as pad defined. The RF
trace from the PCB pad is extended with the same width by 2 mils
and tapered to RF trace with a 45° angle. The paste mask is also
designed to match the pad without any aperture reduction. The
paste is divided into multiple openings for the paddle.
Figure 17. Recommended RF Pin Transitions
For alternate PCB stack-ups with different dielectric thickness and
CPWG design, contact Analog Devices, Inc., Technical Support
Request for further recommendations.



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