Figure 11. Relative variation of critical rate of decrease of

main current versus junction temperature

0

25

50

75

100

125

0

1

2

3

4

5

6

(dl/dt)c [Tj] / [Tj specified]

Tj(°C)

Figure 12. DPAK and D2PAK thermal resistance junction

to ambient versus copper surface under tab

0

4

8

1 2

16

20

24

28

32

36

40

0

10

20

30

40

50

60

70

80

90

100

Rth(j-a)(°C/W)

S(cm²)

Printed circuit board FR4, copper thickness: 35 µm

DPAK

D²PAK

BTA08, BTB08, T810, T835, T850

Characteristics (curves)

DS2114 - Rev 15

page 6/21