T810 datasheet(4/21 Pages) STMICROELECTRONICS

部件名	T810

功能描述	Snubberless™, logic level and standard 8 A Triacs

PDF	21 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

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4 / 21 page

1.1

Characteristics (curves)

Figure 1. Maximum power dissipation versus on-state

RMS current (full cycle)

P(W)

IT(RMS)(A)

Figure 2. RMS on-state current versus temperature (full

cycle)

100

125

IT(RMS)(A)

Tc(°C)

BTB/T8

BTA

Figure 3. RMS on-state current versus ambient

temperature (full cycle)

100

125

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

IT(RMS)(A)

Tc(°C)

Printed circuit board FR4, copper thickness: 35 µm

D²PAK

(S = 1 cm²)

DPAK

(S = 0.5 cm²)

Figure 4. Relative variation of thermal impedance versus

pulse duration

1E-3

1E-2

1E-1

1E+0

1E+1

1E+2

5E+2

1E-3

1E-2

1E-1

1E+0

K = [Zth/Rth]

tp(s)

Zth(j-c)

DPAK/IPAK

Zth(j-a)

TO-220AB/D²PAK

Zth(j-a)

BTA08, BTB08, T810, T835, T850

Characteristics (curves)

DS2114 - Rev 15

page 4/21

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