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T810 数据表(PDF) 9 Page - STMicroelectronics |
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T810 数据表(HTML) 9 Page - STMicroelectronics |
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9 / 21 page ![]() Table 6. DPAK package mechanical data Ref. Dimensions Millimeters Inches(1) Min. Typ. Max. Min. Typ. Max. A 2.18 2.40 0.0858 0.0945 A1 0.90 1.10 0.0354 0.0433 A2 0.03 0.23 0.0012 0.0091 b 0.64 0.90 0.0252 0.354 b4 4.95 5.46 0.1949 0.2150 c 0.46 0.61 0.0181 0.0240 c2 0.46 0.60 0.0181 0.0236 D 5.97 6.22 0.2350 0.2449 D1 5.10 0.2008 E 6.35 6.73 0.2500 0.2650 E1 4.32 0.1701 e 2.29 0.0900 e1 4.57 0.1800 H 9.35 10.40 0.3681 0.4094 L 1.00 1.78 0.0394 0.0701 L2 1.27 0.0500 L4 0.60 1.02 0.0236 0.0402 V2 0° +8° 0° +8° 1. Dimensions in inches are given for reference only Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. Figure 14. DPAK recommended footprint (dimensions are in mm) 6.7 6.7 3.0 3.0 1.6 4.572 A B The device must be positioned within 0.05 AB 12.7 BTA08, BTB08, T810, T835, T850 DPAK package information DS2114 - Rev 15 page 9/21 |
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