F4MP datasheet(31/37 Pages) NXP

31 / 37 page

PTN3355

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Product data sheet

Rev. 3.1 — 4 November 2016

31 of 37

NXP Semiconductors

PTN3355

Low power DP to VGA adapter with integrated 1 : 2 VGA switch

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow

soldering, see Figure 15.

For further information on temperature profiles, refer to Application Note AN10365

“Surface mount reflow soldering description”.

Table 28.

Lead-free process (from J-STD-020D)

Package thickness (mm)

Package reflow temperature (

C)

Volume (mm3)

< 350

350 to 2000

> 2000

< 1.6

260

1.6 to 2.5

260

250

245

> 2.5

250

245

MSL: Moisture Sensitivity Level

Fig 15. Temperature profiles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

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