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KSZ9563RNXC 数据表(PDF) 217 Page - Microchip Technology |
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KSZ9563RNXC 数据表(HTML) 217 Page - Microchip Technology |
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217 / 226 page ![]() 2017-2018 Microchip Technology Inc. DS00002419D-page 217 KSZ9563R FIGURE 8-2: PACKAGE (DIMENSIONS) Microchip Technology Drawing C04-437A Sheet 2 of 2 Number of Terminals Overall Height Terminal Width Overall Width Terminal Length Exposed Pad Width Terminal Thickness Pitch Standoff Units Dimension Limits A1 A b E2 A3 e L E N 0.40 BSC 0.20 REF 6.40 0.35 0.15 0.80 0.00 0.20 0.40 6.50 0.85 0.02 8.00 BSC MILLIMETERS MIN NOM 64 6.60 0.45 0.25 0.90 0.05 MAX K- 0.25 - REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. 1. 2. 3. Notes: Pin 1 visual index feature may vary, but must be located within the hatched area. Package is saw singulated Dimensioning and tolerancing per ASME Y14.5M Terminal-to-Exposed-Pad 64-Lead Very Thin Plastic Quad Flat, No Lead Package (JXX) - 8x8 mm Body [VQFN] For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Overall Length Exposed Pad Length D D2 6.40 8.00 BSC 6.50 6.60 C SEATING PLANE (A3) A1 A DETAIL A |
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