 |
数据搜索系统，热门电子元器件搜索 |
|
|
数据搜索系统，热门电子元器件搜索 |
|
KSZ9563RNXC 数据表(PDF) 218 Page - Microchip Technology |
|
|
|||||||||||||||||||||||||||||
KSZ9563RNXC 数据表(HTML) 218 Page - Microchip Technology |
|
|
218 / 226 page  KSZ9563R DS00002419D-page 218 2017-2018 Microchip Technology Inc. FIGURE 8-3: PACKAGE (LAND PATTERN) RECOMMENDED LAND PATTERN Dimension Limits Units C2 Optional Center Pad Width Contact Pad Spacing Optional Center Pad Length Contact Pitch Y2 X2 6.60 6.60 MILLIMETERS 0.40 BSC MIN E MAX 7.90 Contact Pad Length (X64) Contact Pad Width (X64) Y1 X1 0.80 0.20 Microchip Technology Drawing C04-2437A NOM 64-Lead Very Thin Plastic Quad Flat, No Lead Package (JXX) - 8x8 mm Body [VQFN] SILK SCREEN 1 2 64 C1 C2 E X1 Y1 G1 Y2 X2 C1 Contact Pad Spacing 7.90 Contact Pad to Center Pad (X64) G1 0.20 Thermal Via Diameter V Thermal Via Pitch EV 0.33 1.20 ØV EV EV BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 1. 2. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: |
|
链接网址 |
| ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 数据表链接 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
Chinese ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
