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M24512-R 数据表(PDF) 29 Page - STMicroelectronics

部件名 M24512-R
功能描述  512-Kbit serial I²C bus EEPROM
PDF  47 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

M24512-R 数据表(HTML) 29 Page - STMicroelectronics

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9
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK®
packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions
and product status are available at: www.st.com. ECOPACK® is an ST trademark.
For die information concerning the M24512-W delivered in unsawn wafer, please contact your nearest ST Sales
Office.
9.1
UFDFPN8 (DFN8) package information
UFDFPN8 is an 8-lead, 2 × 3 mm, 0.5 mm thickness ultra thin profile fine pitch dual flat package
Figure 15. UFDFPN8 - Outline
Top view
Pin #1
ID marking
Side view
Seating plane
eee
ccc
C
C
C
C
C
B
A
1 2
N
D
E
aaa
aaa
A
A1
A3
2x
2x
Datum A
Terminal tip
Detail “A”
Even terminal
L1
L3
L
e
e/2
Pin #1
ID marking
Bottom view
See Detail “A”
e
e
1 2
ND-1 x
D2
L1
L3
E2
K
L
b
1.
Max. package war-page is 0.05 mm.
2.
Exposed copper is not systematic and can appear partially or totally according to the cross section.
3.
Drawing is not to scale.
4.
The central pad (the area E2 by D2 in the above illustration) must be either connected to VSS or left floating
(not connected) in the end application.
M24512-W M24512-R M24512-DF
Package information
DS6520 - Rev 31
page 29/47



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