M24512-R datasheet(42/47 Pages) STMICROELECTRONICS

42 / 47 page

Date

Revision

Changes

16-Feb-2015

Removed:

•

Note on Figure 3

•

Note 2 on Table 3

Updated:

•

Note 1 on Table 12 and Table 13

•

Table 18

•

Figure 11

•

Table 20

•

Titles on Figure and Table 21

•

Table 24

•

Note 1 on Table 21

Added:

•

Note 2 on Table 12

•

Note 4 and 5 on Table 14

•

Note 6, 7 and 8 on Table 15

•

Note 6, 7 on Table 16

•

Note 8 on Table 17

•

Figure 20

•

Reference to Engineering sample after Ordering information scheme

27-May-2015

Added:

•

Unsawn wafer reference on cover page and Table 25: Ordering information

scheme (unsawn wafer)

•

Note 1 on Table 12

•

Removed ordering type M24512-DRxxxx from the whole document (device

replaced by either M24512-Rxxx or M24512-DFxxx)

22-Mar-2018

Added:

•

WLCSP8 ultra thin package in cover page

•

Section 9.5: WLCSP8 ultra thin package information

•

Table 3: Device select code

Updated:

•

Figure 3: WLCSP connections

•

Table 10: AC measurement conditions

•

Table 24: Ordering information scheme

21-Sep-2018

Updated:

•

Figure 19: WLCSP - 8 bumps, 1.271 x 1.937 mm, 0.5 mm pitch wafer level

chip scale package outline

•

Figure 21: WLCSP - 8 balls, 1.289x1.955 mm, 1 mm pitch, wafer level chip

scale package outline

06-Oct-2020

Updated:

•

Features

•

Figure 5. Block diagram

Added:

•

Figure 16. UFDFPN8 - Recommended footprint

•

Figure 18. TSSOP8 – Recommended footprint

Removed note in:

•

Table 6. Absolute maximum ratings, Table 7. Operating conditions (voltage

range W), Table 8. Operating conditions (voltage range R), Table 9. Operating

conditions (voltage range F),Table 12. Cycling performance by groups of four

bytes, Table 13. Memory cell data retention, Table 14. DC characteristics

(M24512-W, device grade 6), Table 15. DC characteristics (M24512-R device

grade 6), Table 16. DC characteristics (M24512-DF, device grade 6),

Table 18. 1 MHz AC characteristics

M24512-W M24512-R M24512-DF

DS6520 - Rev 31

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