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M24512-R 数据表(PDF) 35 Page - STMicroelectronics |
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M24512-R 数据表(HTML) 35 Page - STMicroelectronics |
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35 / 47 page ![]() 9.4 WLCSP8 (CS) package information WLCSP8 is a 8 bumps, 1.289 x 1.955 mm, 0.5 mm pitch wafer level chip scale package Figure 21. WLCSP8 - Outline D E Wafer back side Side view Orientation reference e1 e3 e2 e F G Bump side X Y aaa Bump Seating plane Z Detail A rotated by 90° A1 (8X) Detail A A2 A Orientation reference Z Z X Y (4X) b Z bbb Z eee ccc M Ø Ø ddd M 1. Drawing is not to scale 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. M24512-W M24512-R M24512-DF WLCSP8 (CS) package information DS6520 - Rev 31 page 35/47 |
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