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M24512-R 数据表(PDF) 37 Page - STMicroelectronics |
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M24512-R 数据表(HTML) 37 Page - STMicroelectronics |
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37 / 47 page ![]() 9.5 WLCSP8 (CU) package information This WLCSP is a 8 balls, 1.289 x 1.955 mm, 0.5 mm pitch, with BSC, wafer level chip scale package Figure 23. WLCSP8 - Outline X Y D E aaa (2X) aaa (2X) Orientation reference TOP VIEW DETAIL A A3 A1 A A2 b SIDE VIEW Orientation reference F G e e2 e3 e1 BOTTOM VIEW Z eee Z ccc ddd Z Z X Y M M b A1 Seating plane DETAIL A ROTATED 90 1. Drawing is not to scale. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. M24512-W M24512-R M24512-DF WLCSP8 (CU) package information DS6520 - Rev 31 page 37/47 |
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