M24C02-R datasheet(35/41 Pages) STMICROELECTRONICS

35 / 41 page

Revision history

Table 22. Document revision history

Date

Revision

Changes

17-Dec-2012

New M24C01/02 datasheet resulting from splitting the previous datasheet M24C08-x

M24C04-x M24C02-x M24C01-x (revision 18) into separate datasheets.

Added part number M24C02-F. Updated ESD value in Table 4.

Updated standby supply current values (ICCI) in Table 12, Table 13

and Table 14.

24-Sep-2013

Added:

•

Table10: Cycling performance

•

Table7:Operatingconditions (voltage range F) and Table7:Operating

conditions(voltagerange F, for all other devices)

Updated:

•

Features: supply voltage, write cycles and data retention

•

Section1: Description

•

Note (1)under Table4:Absolutemaximum ratings

•

Table11: Memory celldata retention, Table12:DC characteristics (M24C01/02-W,

devicegrade 6), Table 13: DC characteristics (M24C01/02-R device grade 6), Table

14: DC characteristics (M24C02-F, device grade 6), Table 21: Ordering information

scheme

•

Figure11: AC waveforms

Renamed Figure 15and Table21.

06-Dec-2016

Updated: Section 1: Description, noteson Table 4: Absolute maximum ratings, title of Table

7: Operating conditions (voltage range F), note 1 on Table 11: Memory cell data retention,

Table 12: DC characteristics (M24C01/02-W, device grade 6), Table 13: DC characteristics

(M24C01/02-R device grade 6), Table 14: DC characteristics (M24C02-F, device grade 6),

Table 21: Ordering information scheme

Removed Table7:Operatingconditions(voltage rangeF.forallotherdevices)

Added Figure 14: SO8N – 3.9x4.9 mm, 8-lead plastic small outline, 150 mils body width,

package recommended footprint, Engineering samples reference

05-Apr-2017

Updated Section2.3:Chip Enable (E2,E1, E0), Section 4.5:Deviceaddressing, Section5.2.3:

SequentialRead, Table22: Ordering informationscheme

Added UFDFPN5 package in cover page and Section9.1:UFDFPN5(DFN5)package

information

20-Apr-2017

Updated:

•

Figure14:UFDFPN5 -5-lead, 1.7 × 1.4 mm, 0.55 mm thickness, ultra thin fine

pitchdual flat package, no lead recommended footprint and Figure20:UFDFPN8-8-

lead, 2 × 3 mm, 0.5 mm pitch ultra thin profile fine pitch dual flat recommended

footprint

•

Note onSection 5.2.3: Sequential Read

02-Oct-2017

Added reference to DFN8 and DFN5 in:

Figure3: UFDFPN5(DFN5) package connections, Section 9.1:UFDFPN5(DFN5)

package information, Section9.5:UFDFPN8 (DFN8) package information,

Table22:Orderinginformationscheme

M24C01/02-W M24C01/02-R M24C02-F

DS9398 - Rev 7

page 35/41

M24C02-R 数据表(PDF) 35 Page - STMicroelectronics

M24C02-R 数据表(HTML) 35 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41

数据表下载