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STM32G0C1NET3 数据表(PDF) 137 Page - STMicroelectronics

部件名 STM32G0C1NET3
功能描述  Arm® Cortex®-M0 32-bit MCU, up to 512KB Flash, 144KB RAM,6x USART, timers, ADC, DAC, comm. I/Fs, AES, RNG, 1.7-3.6V
PDF  159 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STM32G0C1NET3 数据表(HTML) 137 Page - STMicroelectronics

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DS13564 Rev 4
137/159
STM32G0C1xC/xE
Package information
154
6.5
WLCSP52 package information
WLCSP52 is a 52-ball, 3.09 x 3.15 mm, 0.4 mm pitch, wafer-level chip-scale package.
Figure 49. WLCSP52 - Outline
1. Drawing is not to scale.
2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
3. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
4. Bump position designation per JESD 95-1, SPP-010.
Table 84. WLCSP52 - Mechanical data
Symbol
millimeters
inches(1)
Min
Typ
Max
Min
Typ
Max
A(2)
-
-
0.58
-
-
0.023
A1
-
0.17
-
-
0.007
-
A2
-
0.38
-
-
0.015
-
A3(3)
-
0.025
-
-
0.001
-
G
E
e2
F
D
e1
aaa
(4x)
DETAIL B
A
B
C
D
E
F
G
H
1
2
3
4
5
6
7
8
9
10
11
12
13
A1 BALL ORIENTATION
bbb Z
A1
A2
A
A2
DETAIL A
DETAIL A
BUMP
SEATING PLANE
DETAIL B
ccc
ddd
Z
Z
XY
b(52x)
Z
eee Z
BOTTOM VIEW
TOP VIEW
SIDE VIEW
FRONT VIEW
B0BG_WLCSP52_ME_V1



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