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STM32G0C1NET3 数据表(PDF) 141 Page - STMicroelectronics |
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STM32G0C1NET3 数据表(HTML) 141 Page - STMicroelectronics |
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141 / 159 page  DS13564 Rev 4 141/159 STM32G0C1xC/xE Package information 154 Figure 53. Recommended footprint for UFBGA64 package ddd - - 0.080 - - 0.0031 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 86. UFBGA64 package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.460 0.530 0.600 0.0181 0.0209 0.0236 Table 87. Recommended PCB design rules for UFBGA64 package Dimension Recommended values Pitch 0.5 Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the solder mask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.100 mm BGA_WLCSP_FT_V1 Dsm Dpad |
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