Table 3. VFDFPN8 - mechanical data

Symbol

Millimeters

Inches (1)

Min

Typ

Max

Min

Typ

Max

A

0.700

0.850

1.000

0.0276

0.0335

0.0393

A1

0

0.020

0.050

0

0.0008

0.0012

A3

-

0.200

-

-

0.0079

-

b

0.350

0.400

0.480

0.0138

0.0157

0.0189

D

-

5.000

-

-

0.1969

-

E

-

6.000

-

-

0.2362

-

e

-

1.270

-

-

0.0500

-

L

0.400

0.500

0.600

0.0157

0.0197

0.0236

D2

4.100

4.200

4.300

0.1614

0.1654

0.1693

E2

3.300

3.400

3.500

0.1299

0.1339

0.1378

1. The dimensions are converted from mm and rounded to 4 decimal digits.

7.1.1

Wettable flank for manufacture of inspectable solder joint

Traditional lead free packages tend be critical components in high reliability application, due to inspection issues

of the solder joint between the leads and the PCB pads.

Figure 8. Regular DFN (non-wettable flank)

Figure 9. DFN wettable flank

VFDFPN8 package is constructed with "WETTABLE" flanks, a "dimpled" pad formed during the half-etching step

of the lead frame manufacturing process.

The wettable flank feature, in conjunction with an optimized board mount process, promotes formation of solder

joints which can be easily inspected. The presence of a solder fillet improves the inspection capability of the

solder joints by automated optical inspection.

ST4SIM-200M

VFDFPN8 package information

DB4082 - Rev 5

page 13/26