Figure 10. Solder joint side view

Figure 11. Solder joint top view

This package is compliant with machine to machine form factor defined by ETSI in TS 102 671.

7.1.2

Pinout information

This package is compatible with the MFF2 package defined by ETSI 102 671 release 12. The pinout details are

described in the following figure and table together with PCB integrations recommendations in Figure 13.

Figure 12. VFDFPN8 pinout (top view)

1

2

3

4

5

6

7

8

VCC

RESET

CLK

NC

GND

SWIO

I/O

NC

Table 4. Pin descriptions

Name

Description

Pin state

GND

Ground supply

-

SWIO

Not used

Input pull-up

RESET

External reset

Input pull-down

I/O

Input/output

Pull-down then pull-up after card activation

CLK

External clock

Pull-down

VCC

Power supply

-

NC

Not connected internally

-

ST4SIM-200M

VFDFPN8 package information

DB4082 - Rev 5

page 14/26