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ST4SIM-200M 数据表(PDF) 22 Page - STMicroelectronics |
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ST4SIM-200M 数据表(HTML) 22 Page - STMicroelectronics |
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22 / 26 page ![]() Revision history Table 10. Document revision history Date Version Change 25-Nov-2019 1 Initial release. 14-Feb-2020 2 Modified Section 1 Description. Added Section 2 Cellular connectivity solutions overview, Electrical characteristics and Section 7 Package information. 19-May-2020 3 Modified symbol column for D2, E, E2, e and L in Section 7.1 05-Oct-2020 4 Added: • Section 2 Cellular connectivity solutions overview • Section 3 eSIM GSMA solution • Section 5.1 Supported standards and networks • Section 7.1.1 Wettable flank for manufacture of inspectable solder joint • Section 7.1.3 Tape and reel packing • Section 7.2 2FF, 3FF or 4FF plugin card package information (based on D16 micromodule) • Section 7.3 WLCSP11 package information Updated: • Section 7.1 VFDFPN8 package information Moved Section 7.1.2 Pinout information 19-Jan-2021 5 Updated: • The document title • Section 1 Description • Table 7. SIM plugin package types and dimensions ST4SIM-200M DB4082 - Rev 5 page 22/26 |
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