List of figures

Figure 1.

SIM solution overview ............................................................... 4

Figure 2.

eSIM solution overview .............................................................. 4

Figure 3.

eSIM GSMA solution overview ......................................................... 5

Figure 4.

eSIM architecture overview ........................................................... 5

Figure 5.

ST4SIM-200M architecture eSIM & eSE overview ............................................ 7

Figure 6.

Recommended filtering capacitors on VCC ................................................ 10

Figure 7.

VFDFPN8 - outline ................................................................ 12

Figure 8.

Regular DFN (non-wettable flank) ...................................................... 13

Figure 9.

DFN wettable flank ................................................................ 13

Figure 10.

Solder joint side view............................................................... 14

Figure 11.

Solder joint top view ............................................................... 14

Figure 12.

VFDFPN8 pinout (top view) .......................................................... 14

Figure 13.

ST4SIM-200M PCB integration recommendations........................................... 15

Figure 14.

13 " reel diagram ................................................................. 16

Figure 15.

Leader and trailer ................................................................. 16

Figure 16.

Embossed carrier tape for VFDFPN8 (5 × 6 mm) ........................................... 17

Figure 17.

Component orientation ............................................................. 17

Figure 18.

D16 micromodule contact assignment ................................................... 19

ST4SIM-200M

List of figures

DB4082 - Rev 5

page 25/26