7.2

2FF, 3FF or 4FF plugin card package information (based on D16 micromodule)

The ST4SIM-200M card is based on flexible plastic chip cards, composed of ABS and Polycarbonate, improving

all round resistance in an industrial environment. This card contains a STMicroelectronics industrial grade D16

micromodule.

All elements; card and micromodule, are designed to run at a temperature of -40 °C to +105 °C.

The ST4SIM-200M is available for different card plugin packages as detailed in the table below.

Table 7. SIM plugin package types and dimensions

Package

Mini SIM (2FF)

Micro SIM (3FF)

Nano SIM (4FF)

Package format

Height

25 mm (±0.1 mm)

15 mm (±0.1 mm)

12.3 mm (±0.1 mm)

Width

15 mm (±0.1 mm)

12 mm (±0.1 mm)

8.8 mm (±0.1 mm)

Thickness

0.76 mm (±0.08 mm)

0.76 mm (±0.08 mm)

0.67 mm (+ 0.03 mm / - 0.07 mm)

Note:

These formats comply to the ISO/IEC 7810 and ETSI TS 102 221 standards.

7.2.1

D16 micromodule pinout information

The contact of D16 micromodule are compliant with ISO/IEC 7816-3 standard. The contact assignment layout is

given in the figure below and contact description is in the following table.

ST4SIM-200M

2FF, 3FF or 4FF plugin card package information (based on D16 micromodule)

DB4082 - Rev 5

page 18/26