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R2000 数据表(PDF) 73 Page - List of Unclassifed Manufacturers

部件名 R2000
功能描述  Indy® R2000 Reader Chip (IPJ-R2000) Electrical, Mechanical, & Thermal Specification
PDF  75 Pages
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制造商  ETC [List of Unclassifed Manufacturers]
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标志 ETC - List of Unclassifed Manufacturers

R2000 数据表(HTML) 73 Page - List of Unclassifed Manufacturers

Back Button R2000 Datasheet HTML 67Page - List of Unclassifed Manufacturers R2000 Datasheet HTML 68Page - List of Unclassifed Manufacturers R2000 Datasheet HTML 69Page - List of Unclassifed Manufacturers R2000 Datasheet HTML 70Page - List of Unclassifed Manufacturers R2000 Datasheet HTML 71Page - List of Unclassifed Manufacturers R2000 Datasheet HTML 72Page - List of Unclassifed Manufacturers R2000 Datasheet HTML 73Page - List of Unclassifed Manufacturers R2000 Datasheet HTML 74Page - List of Unclassifed Manufacturers R2000 Datasheet HTML 75Page - List of Unclassifed Manufacturers  
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Indy® R2000 Electrical, Mechanical, & Thermal Specification
Revision 2.0, Copyright © 2015, Impinj, Inc.
73
8.7
Aux. DAC Testing
Figure 8-14 shows the output voltage plot for the auxiliary DACs. Figure 8-15 shows the integral and differential non
linearity for both DACs. For both of these measurements the output of the DAC is loaded with a 500
 load.
Figure 8-14: DAC0 and DAC1 Output Voltage versus Count
0
0.5
1
1.5
2
2.5
3
0
50
100
150
200
250
300
DAC count
DAC1
DAC0
Figure 8-15: INL and DNL for DAC0(left) and DAC1(right)
9
Package Information
The Indy R2000 reader chip RFID Radio chip is packaged in a 64 pin, 9 mm x 9 mm x 0.85 mm, 0.50 mm pitch, quad
flat no-lead (QFN) package. This product has a moisture sensitivity level of 3
. Parts are delivered in “dry baked”
trays. Parts from broken trays (open trays) or samples must be baked for 24hrs at 125C before soldering. Figure
8-16 illustrates the top view of the Indy R2000 reader chip package, and Figure 8-17 provides the dimensions for the
package.



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