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MCP621 数据表(PDF) 21 Page - Microchip Technology |
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MCP621 数据表(HTML) 21 Page - Microchip Technology |
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21 / 68 page ![]() 2009-2021 Microchip Technology Inc. and its subsidiaries DS20002188E-page 21 MCP621/1S/2/3/4/5/9 3.1 Analog Outputs The analog output pins (VOUT) are low-impedance voltage sources. 3.2 Analog Inputs The noninverting and inverting inputs (VIN+, VIN–, …) are high-impedance CMOS inputs with low bias currents. 3.3 Power Supply Pins The positive power supply (VDD) is 2.5V to 5.5V higher than the negative power supply (VSS). For normal operation, the other pins are between VSS and VDD. Typically, these parts are used in a single (positive) supply configuration. In this case, VSS is connected to ground and VDD is connected to the supply. VDD will need bypass capacitors. 3.4 Calibration Common Mode Voltage Input A low-impedance voltage placed at this input (VCAL) will set the op amps’ Common mode input voltage during calibration. If this pin is left open, the Common mode input voltage during calibration is approximately VDD/3. The internal resistor divider is disconnected from the supplies whenever the part is not in calibration. 3.5 Calibrate/Chip Select Digital Input This input (CAL/CS, …) is a CMOS, Schmitt-triggered input that affects the Calibration and Low-Power modes of operation. When this pin goes high, the part is placed into a Low-Power mode and the output is High Z. When this pin goes low, a calibration sequence is started (which corrects VOS). At the end of the cali- bration sequence, the output becomes low-impedance and the part resumes normal operation. An internal POR triggers a calibration event when the part is powered-on, or when the supply voltage drops too low. Thus, the MCP622 parts are calibrated, even though they do not have a CAL/CS pin. 3.6 Exposed Thermal Pad (EP) There is an internal connection between the Exposed Thermal Pad (EP) and the VSS pin; they must be connected to the same potential on the Printed Circuit Board (PCB). This pad can be connected to a PCB ground plane to provide a larger heat sink. This improves the package thermal resistance ( JA). |
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