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MCP621 数据表(PDF) 63 Page - Microchip Technology |
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MCP621 数据表(HTML) 63 Page - Microchip Technology |
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63 / 68 page ![]() 2009-2021 Microchip Technology Inc. and its subsidiaries DS20002188E-page 63 MCP621/1S/2/3/4/5/9 Microchip Technology Drawing C04-127D Sheet 2 of 2 Number of Pins Overall Height Overall Width Contact Width Overall Length Exposed Pad Width Exposed Pad Length Contact Thickness Pitch Standoff Units Dimension Limits e E2 b D2 D A3 E A1 A N MIN 0.65 BSC 0.20 REF 2.50 0.25 2.50 0.80 0.00 2.65 0.30 4.00 BSC 2.65 - 0.90 4.00 BSC 0.02 NOM MILLIMETERS 16 2.80 0.35 2.80 - 1.00 0.05 MAX Contact Length L 0.30 0.40 0.50 REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M Notes: Contact-to-Exposed Pad K 0.20 For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: 16-Lead Plastic Quad Flat, No Lead Package (ML) - 4x4x0.9mm Body [QFN] |
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