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ADRF5022BCCZN-R7 数据表(PDF) 5 Page - Analog Devices |
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ADRF5022BCCZN-R7 数据表(HTML) 5 Page - Analog Devices |
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5 / 12 page ![]() Data Sheet ADRF5022 ABSOLUTE MAXIMUM RATINGS analog.com Rev. 0 | 5 of 12 For recommended operating conditions, see Table 1 and Table 2. Table 3. Absolute Maximum Ratings Parameter Rating Supply Voltage Positive −0.3 V to +3.6 V Negative −3.6 V to +0.3 V Digital Control Input Voltage Voltage −0.3 V to VDD + 0.3 V Current 3 mA RF Input Power, Dual Supply1 (VDD = 3.3 V, VSS = −3.3 V, f = 250 MHz to 40 GHz, TCASE = 85°C) Through Path 31 dBm Terminated Path 25 dBm Hot Switching (RFC Port) 31 dBm RF Input Power, Single Supply1 (VDD = 3.3 V, VSS = 0 V, f = 250 MHz to 40 GHz, TCASE = 85°C) Through Path 18 dBm Terminated Path 13 dBm Hot Switching (RFC Port) 18 dBm RF Power Under Unbiased Condition (VDD, VSS = 0 V) 18 dBm Temperature Junction (TJ) 135°C Storage −65°C to +150°C Reflow 260°C 1 For power derating over frequency, see Figure 2 and Figure 3. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operat- ing conditions for extended periods may affect product reliability. THERMAL RESISTANCE Thermal performance is directly linked to the printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. θJC is the junction-to-case bottom (channel-to-package bottom) thermal resistance. Table 4. Thermal Resistance Package Type θJC1 Unit CC-20-19 Through Path 120 °C/W Terminated Path 200 °C/W 1 θJC is determined by simulation under the following conditions: the heat transfer is due solely to the thermal conduction from the channel through the ground pad to the PCB, and the ground pad is held constant at the operating temperature of 85°C. POWER DERATING CURVES Figure 2. Power Derating vs. Frequency, Low-Frequency Detail, TCASE = 85°C Figure 3. Power Derating vs. Frequency, High-Frequency Detail, TCASE = 85°C |
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