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ADRF5022BCCZN-R7 数据表(PDF) 5 Page - Analog Devices

部件名 ADRF5022BCCZN-R7
功能描述  Silicon SPDT Switch, Nonreflective, 100 MHz to 45 GHz
PDF  12 Pages
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制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADRF5022BCCZN-R7 数据表(HTML) 5 Page - Analog Devices

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Data Sheet
ADRF5022
ABSOLUTE MAXIMUM RATINGS
analog.com
Rev. 0 | 5 of 12
For recommended operating conditions, see Table 1 and Table 2.
Table 3. Absolute Maximum Ratings
Parameter
Rating
Supply Voltage
Positive
−0.3 V to +3.6 V
Negative
−3.6 V to +0.3 V
Digital Control Input Voltage
Voltage
−0.3 V to VDD + 0.3 V
Current
3 mA
RF Input Power, Dual Supply1 (VDD = 3.3 V, VSS =
−3.3 V, f = 250 MHz to 40 GHz, TCASE = 85°C)
Through Path
31 dBm
Terminated Path
25 dBm
Hot Switching (RFC Port)
31 dBm
RF Input Power, Single Supply1 (VDD = 3.3 V, VSS = 0
V, f = 250 MHz to 40 GHz, TCASE = 85°C)
Through Path
18 dBm
Terminated Path
13 dBm
Hot Switching (RFC Port)
18 dBm
RF Power Under Unbiased Condition (VDD, VSS = 0 V) 18 dBm
Temperature
Junction (TJ)
135°C
Storage
−65°C to +150°C
Reflow
260°C
1 For power derating over frequency, see Figure 2 and Figure 3.
Stresses at or above those listed under Absolute Maximum Ratings
may cause permanent damage to the product. This is a stress
rating only; functional operation of the product at these or any other
conditions above those indicated in the operational section of this
specification is not implied. Operation beyond the maximum operat-
ing conditions for extended periods may affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to the printed circuit board
(PCB) design and operating environment. Careful attention to PCB
thermal design is required.
θJC is the junction-to-case bottom (channel-to-package bottom)
thermal resistance.
Table 4. Thermal Resistance
Package Type
θJC1
Unit
CC-20-19
Through Path
120
°C/W
Terminated Path
200
°C/W
1 θJC is determined by simulation under the following conditions: the heat
transfer is due solely to the thermal conduction from the channel through the
ground pad to the PCB, and the ground pad is held constant at the operating
temperature of 85°C.
POWER DERATING CURVES
Figure 2. Power Derating vs. Frequency, Low-Frequency Detail, TCASE = 85°C
Figure 3. Power Derating vs. Frequency, High-Frequency Detail, TCASE = 85°C



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