ST7538Q datasheet(42/44 Pages) STMICROELECTRONICS

42 / 44 page

Package mechanical data

ST7538Q

42/44

Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect . The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com

Best thermal performance is achieved when slug is soldered to PCB.

It is recommended to have five solder dots (See Figure 27) without resist to connect the

Copper slug to the ground layer on the soldering side. Moreover it is recommitted to connect

the ground layer on the soldering side to another ground layer on the opposite side with 15

to 20 vias.

It is suggested to not use the PCB surface below the slug area to interconnect any pin

except ground pins.

Figure 26. ST7538Q slug drawing

Figure 27. Soldering information

Copper Slug

Solder plated

Lead frame

0.10mm ±0.05

D03IN1414

Solder dots

Cu plate

D03IN1413

Package Sizes

10x10x1.4mm

2.00 mm

1.00 mm

6.00 mm

L1 (Copper plate)

10.00 mm

If PCB with ground layer, connect

copper plate with 15 to 20 vias

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