ISP1122ABD datasheet(43/48 Pages) PHILIPS

43 / 48 page

Philips Semiconductors

ISP1122A

USB stand-alone hub

Preliminary speciﬁcation

Rev. 01 — 27 March 2000

43 of 48

9397 750 06986

During placement and before soldering, the package must be ﬁxed with a droplet of

adhesive. The adhesive can be applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time is 4 seconds at 250

°C. A mildly-activated ﬂux will eliminate the

need for removal of corrosive residues in most applications.

18.2.3

Manual soldering

Fix the component by ﬁrst soldering two diagonally-opposite end leads. Use a low

voltage (24 V or less) soldering iron applied to the ﬂat part of the lead. Contact time

must be limited to 10 seconds at up to 300

°C.

When using a dedicated tool, all other leads can be soldered in one operation within

2 to 5 seconds between 270 and 320

°C.

18.3 Through-hole mount packages

18.3.1

Soldering by dipping or by solder wave

The maximum permissible temperature of the solder is 260

°C; solder at this

temperature must not be in contact with the joints for more than 5 seconds. The total

contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the

plastic body must not exceed the speciﬁed maximum storage temperature (Tstg(max)).

If the printed-circuit board has been pre-heated, forced cooling may be necessary

immediately after soldering to keep the temperature within the permissible limit.

18.3.2

Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the

seating plane or not more than 2 mm above it. If the temperature of the soldering iron

bit is less than 300

°C it may remain in contact for up to 10 seconds. If the bit

temperature is between 300 and 400

°C, contact may be up to 5 seconds.

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