M700000002 datasheet(9/128 Pages) SPANSION

9 / 128 page

November 25, 2003

Am70PDL127BDH/Am70PDL129BDH

AD VAN C E

INFORM ATION

Erase and Program Operations ............................................ 112

Figure 17. Program Operation Timings......................................... 113

Figure 18. Accelerated Program Timing Diagram......................... 113

Figure 19. Chip/Sector Erase Operation Timings ......................... 114

Figure 20. Data# Polling Timings (During Embedded Algorithms) 115

Figure 21. Toggle Bit Timings (During Embedded Algorithms)..... 116

Figure 22. DQ2 vs. DQ6................................................................ 116

Temporary Sector Unprotect ................................................ 117

Figure 23. Temporary Sector Group Unprotect Timing Diagram .. 117

Figure 24. Sector Group Protect and Unprotect Timing Diagram . 118

Alternate CE# Controlled Erase and Program Operations ... 119

Figure 25. Alternate CE# Controlled Write (Erase/Program)

Operation Timings........................................................................ 120

Erase And Programming Performance . . . . . . 121

Latchup Characteristics . . . . . . . . . . . . . . . . . . . 121

Package Pin Capacitance. . . . . . . . . . . . . . . . . . 122

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . 123

FUA093—93-Ball Fine-Pitch Grid Array 13 x 9 mm package 123

Revision Summary . . . . . . . . . . . . . . . . . . . . . . . 124

M700000002 数据表(PDF) 9 Page - SPANSION