PCF85063ATLSLASH1 datasheet(45/55 Pages) NXP

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NXP Semiconductors

PCF85063A

Tiny Real-Time Clock/calendar with alarm function and I2C-bus

• Package footprints, including solder thieves and orientation

• The moisture sensitivity level of the packages

• Package placement

• Inspection and repair

• Lead-free soldering versus SnPb soldering

17.3 Wave soldering

Key characteristics in wave soldering are:

• Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave

parameters, and the time during which components are exposed to the wave

• Solder bath specifications, including temperature and impurities

17.4 Reflow soldering

Key characteristics in reflow soldering are:

• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak

temperatures (see Figure 35) than a SnPb process, thus reducing the process window

• Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large

and small components on one board

• Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak

temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to

make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low

enough that the packages and/or boards are not damaged. The peak temperature of the package depends on

package thickness and volume and is classified in accordance with Table 42 and Table 43

Package reflow temperature (°C)

Volume (mm³)

Package thickness (mm)

< 350

≥ 350

< 2.5

235

220

≥ 2.5

220

Table 42. SnPb eutectic process (from J-STD-020D)

Package reflow temperature (°C)

Volume (mm³)

Package thickness (mm)

< 350

350 to 2000

> 2000

< 1.6

260

1.6 to 2.5

260

250

245

> 2.5

250

245

Table 43. Lead-free process (from J-STD-020D)

Moisture sensitivity precautions, as indicated on the packing, must be respected at all times.

Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 35.

PCF85063A

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 7.1 — 8 November 2023

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