TMD3702VC datasheet(47/57 Pages) OSRAM

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[v2-00] 2023-Mar-14

TMD3702VC − Soldering & Storage Information

The FN package has been tested and has demonstrated an

ability to be reflow soldered to a PCB substrate.

The solder reflow profile describes the expected maximum heat

exposure of components during the solder reflow process of

product on a PCB. Temperature is measured on top of

component. The components should be limited to a maximum

of three passes through this solder reflow profile.

Figure 71:

Solder Reflow Profile

Note(s):

1. Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum.

Profile Feature

Preheat/ Soak

Sn-Pb Eutectic Assembly

Pb-Free Assembly

Temperature Min (Tsmin)

100 °C

150 °C

Temperature Max (Tsmax)

150 °C

200 °C

Time (ts) from (Tsmin to Tsmax)

60-120 seconds

Ramp-up rate (TL to TP)

3 °C/second max.

Liquidous temperature (TL)

Time (tL) maintained above TL

183 °C

60-150 seconds

217 °C

60-150 seconds

Peak package body temperature (TP)

For users TP must not exceed the

classification temp. of 235 °C

For suppliers TP must equal or

exceed the classification temp

of 235 °C

For users TP must not exceed the

classification temp. of 260 °C

For suppliers TP must equal or

exceed the classification temp of

260 °C

Time (tP)

(1) within 5 °C of the specified

classification temperature (Tc)

20 (1)seconds

30 (1)seconds

Ramp-down rate (TP to TL)

6 °C/second max.

Time 25 °C to peak temperature

6 minutes max.

8 minutes max.

Soldering & Storage

Information

TMD3702VC 数据表(PDF) 47 Page - OSRAM GmbH

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