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MPC866PCZP100A 数据表(PDF) 92 Page - Freescale Semiconductor, Inc |
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MPC866PCZP100A 数据表(HTML) 92 Page - Freescale Semiconductor, Inc |
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92 / 96 page ![]() MPC866/MPC859 Hardware Specifications, Rev. 2 92 Freescale Semiconductor Mechanical Data and Ordering Information 15.2 Mechanical Dimensions of the PBGA Package For more information on the printed-circuit board layout of the PBGA package, including thermal via design and suggested pad layout, please refer to Plastic Ball Grid Array Application Note (order number: AN1231/D) available from your local Freescale sales office. Figure 79 shows the mechanical dimensions of the PBGA package. Figure 79. Mechanical Dimensions and Bottom Surface Nomenclature of the PBGA Package Note: Solder sphere composition for MPC866XZP, MPC859PZP, MPC859DSLZP, and MPC859TZP is 62%Sn 36%Pb 2%Ag |
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