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MPC866PCZP100A 数据表(PDF) 93 Page - Freescale Semiconductor, Inc |
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MPC866PCZP100A 数据表(HTML) 93 Page - Freescale Semiconductor, Inc |
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93 / 96 page ![]() MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 93 Document Revision History 16 Document Revision History Table 40 lists significant changes between revisions of this document. Table 40. Document Revision History Revision Number Date Substantive Changes 0 5/2002 Initial revision 1 11/2002 Added the 5-V tolerant pins, new package dimensions, and other changes. 1.1 4/2003 Added the Spec. B1d and changed spec. B1a. Added the Note Solder sphere composition for MPC866XZP, MPC859DSLZP, and MPC859TZP is 62%Sn 36%Pb 2%Ag to Figure 15-79. 1.2 4/2003 Added the MPC859P. 1.3 5/2003 Changed the SPI Master Timing Specs. 162 and 164. 1.4 7-8/2003 • Added TxClav and RxClav to PB15 and PC15. Changed B28a through B28d and B29b to show that TRLX can be 0 or 1. • Added nontechnical reformatting. 1.5 3/14/2005 • Updated document template. 2 2/10/2006 • Updated orderable parts table. |
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