24CSM01-ESLASHP datasheet(43/63 Pages) MICROCHIP

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 2023 Microchip Technology Inc. and its subsidiaries

Preliminary

DS20006781B

-page 43

24CSM01

Microchip Technology Drawing No. C04-018-P Rev G Sheet 2 of 2

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]

Units

INCHES

Dimension Limits

MIN

NOM

MAX

Number of Pins

Pitch

.100 BSC

Top to Seating Plane

.210

Molded Package Thickness

.115

.130

.195

Base to Seating Plane

.015

Shoulder to Shoulder Width

.290

.310

.325

Molded Package Width

.240

.250

.280

Overall Length

.348

.365

.400

Tip to Seating Plane

.115

.130

.150

Lead Thickness

.008

.010

.015

Upper Lead Width

.040

.060

.070

Lower Lead Width

.014

.018

.022

Overall Row Spacing

.430

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

protrusions shall not exceed .010" per side.

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or

Pin 1 visual index feature may vary, but must be located within the hatched area.

§ Significant Characteristic

Dimensioning and tolerancing per ASME Y14.5M

DATUM A

ALTERNATE LEAD DESIGN

(NOTE 5)

5. Lead design above seating plane may vary, based on assembly vendor.

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