Data Sheet

AD8155

Rev. A | Page 35 of 35

OUTLINE DIMENSIONS

0.30

0.25

0.18

0.80

0.75

0.70

0.50

BSC

BOTTOM VIEW

TOP VIEW

6.30

6.20 SQ

6.10

0.05 MAX

0.02 NOM

0.203 REF

COPLANARITY

0.08

9.10

9.00 SQ

8.90

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.20 MIN

7.50 REF

COMPLIANT TO JEDEC STANDARDS MO-220-WMMD

1

64

16

17

49

48

32

33

0.45

0.40

0.35

EXPOSED

PAD

END VIEW

DETAIL A

(JEDEC 95)

PIN 1

IN D IC ATO R AR E A OP T IO N S

(SEE DETAIL A)

PIN 1

INDICATOR

AREA

SEATING

PLANE

Figure 52. 64-Lead Lead Frame Chip Scale Package [LFCSP]

9 mm × 9 mm Body and 0.75 mm Package Height

(CP-64-17)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

AD8155ACPZ

−40°C to +85°C

64-Lead Lead Frame Chip Scale Package [LFCSP]

CP-64-17

AD8155ACPZ-R7

−40°C to +85°C

64-Lead Lead Frame Chip Scale Package [LFCSP]

CP-64-17

AD8155-EVALZ

Evaluation Board

1 Z = RoHS Compliant Part.

I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).

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registered trademarks are the property of their respective owners.

D08262-3/21(A)