Data Sheet

ADIN2299

THEORY OF OPERATION

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Rev. D | 19 of 21

REFLOW PROFILE

When soldering the ADIN2299 module to a PCB, there are specifics

regarding the reflow temperature profile that must be followed to

ensure that the module is correctly soldered onto the PCB (see

Figure 15 and Table 17).

Figure 15. High Peak Reflow Temperature Profile (SMT Process)

Table 17. High Peak Reflow Temperature Profile Specifications

Item

Temperature Change

Profile Data (seconds)

Ramp Rate (°C/sec)

30°C to approximately 150°C

0.86

Soak Time (sec) at 170°C to Approximately 220°C

70°C to approximately 100°C

77.07

Dwell Time (sec) at More Than 220°C

60°C to approximately 90°C

84.82

Peak Temperature (°C)

245°C to approximately 255°C

247.69

Cooling Rate (°C/sec)

Peak to approximately 150°C

0.50