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TDF8541TH/N2 数据表(PDF) 47 Page - NXP Semiconductors |
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TDF8541TH/N2 数据表(HTML) 47 Page - NXP Semiconductors |
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47 / 54 page ![]() TDF8541 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 3 — 13 December 2011 47 of 54 NXP Semiconductors TDF8541 I2C-bus controlled 4 45 W power amplifier 15. Package outline Fig 32. Package outline SOT827-1 (DBS27P) UNIT A D(1) E(1) REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 19 A2 4.65 4.35 bp 0.60 0.45 DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. SOT827-1 - - - - - - - - - 0 10 20 mm scale L E A c A2 m L3 L4 L2 Q w M bp d Z e1 e2 e 1 27 DBS27P: plastic DIL-bent-SIL (special bent) power package; 27 leads (lead length 6.8 mm) SOT827-1 v M D x h Eh non-concave view B: mounting base side B D c Z(1) de e1 e2 L3 Dh Eh Lm 0.5 0.3 29.2 28.8 25.8 25.4 12 2 15.9 15.5 14 1.15 0.85 L2 3.9 3.1 L4 22.9 22.1 8 1.8 1.2 2.1 1.8 3.4 3.1 4 6.8 Q j 0.25 w 0.6 v 0.03 x j 03-07-29 |
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