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TDF8541TH/N2 数据表(PDF) 50 Page - NXP Semiconductors |
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TDF8541TH/N2 数据表(HTML) 50 Page - NXP Semiconductors |
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50 / 54 page ![]() TDF8541 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 3 — 13 December 2011 50 of 54 NXP Semiconductors TDF8541 I2C-bus controlled 4 45 W power amplifier Fig 35. Package outline SOT1154-1 (DBSMS27P) References Outline version European projection Issue date IEC JEDEC JEITA SOT1154-1 - - - - - - - - - sot1154-1_po 10-03-15 11-10-31 Unit mm max nom min 4.65 4.50 4.35 0.10 0.00 -0.08 0.5 0.60 0.50 0.45 0.5 0.4 0.3 29.2 29.0 28.8 12 15.9 15.7 15.5 1 5.03 4.83 4.63 1.20 1.00 0.80 A Dimensions Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. DBSMS27P: plastic dual bent surface mounted SIL power package; 27 leads SOT1154-1 A1 A2 4.65 4.50 4.35 A3 bp cD(1) 1.43 1.25 1.07 1.43 1.25 1.07 2.10 1.95 1.80 Lp1 Lp2 Q d 25.8 25.6 25.4 Dh E(1) e 2 e1 Eh R1 R2 8 0.35 0.25 0.15 0.35 0.25 0.15 j 3.55 3.40 3.25 L1 3.03 2.83 2.63 L2 L3 3.20 3.00 2.80 L4 0.25 0.03 1.8 1.5 1.2 9° 6° 3° 10° 7° 4° Z(1) θ1 θ2 v 0.6 aaa 0.1 wx 0.1 y 0 10 20 mm scale v X A1 A2 c Q L1 L2 E y D 27 1 Z d Dh Eh j bp e1 e w x non-concave Lp1 Lp2 L3 L4 gauge plane seating plane A3 S θ1 θ2 S aaa detail X |
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