MPX2003

– UP TO 140kHz ALL-IN-ONE FLYBACK CONTROLLER

MPX2003 Rev. 1.0

MonolithicPower.com

5

8/5/2022

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ABSOLUTE MAXIMUM RATINGS (1)

HV to PGND ...............................-0.3V to +650V

SRD to SGND ................................-1V to +150V

VCC to PGND ...............................-0.3V to +35V

PDRV to PGND.............................-0.3V to +16V

SDRV to SGND.............................-0.3V to +16V

VDD to SGND ...............................-0.3V to +35V

CS, PEP to PGND .......................-0.3V to +6.5V

COMP, FB, IS to SGND...............-0.3V to +6.5V

Continuous power dissipation (TA = 25°C) (2)

TSOICW16-15 ........................................... 2.7W

SOICW-16 ................................................. 2.8W

Junction temperature ................................150°C

Lead temperature .....................................260°C

Storage temperature ................ -60°C to +150°C

Recommended Operating Conditions (3)

Operating junction temp (TJ) .... -40°C to +125°C

VCC to PGND .................................. 9.5V to 24V

VDD to SGND .................................. 4.8V to 30V

Thermal Resistance (4)

θJA

θJC

TSOICW16-15 ....................... 45....... 18 ... °C/W

SOICW-16 ............................. 44....... 24 ... °C/W

Notes:

1)

Exceeding these ratings may damage the device.

2)

The maximum allowable power dissipation is a function of the

maximum junction temperature, TJ (MAX), the junction-to-

ambient

thermal

resistance,

θ

JA,

and

the

ambient

temperature, TA. The maximum allowable continuous power

dissipation at any ambient temperature is calculated by PD

(MAX) = (TJ (MAX) - TA) / θJA. Exceeding the maximum

allowable power dissipation can produce an excessive die

temperature, and the regulator may go into thermal

shutdown. Internal thermal shutdown circuitry protects the

device from permanent damage.

3)

The device is not guaranteed to function outside of its

operating conditions.

4)

Measured on JESD51-7, 4-layer PCB.